The World’s Leading Ultrasonic Machining Company

We provide unique machining & drilling solutions for hard, brittle, and specialty materials, so your team doesn’t have to compromise its design.

ISO 9001 Certified

AS9100 Certified

IATF 16949 Compliant

ITAR Registered

Traditional Machining Limits Shouldn’t Hold You Back

Now they don’t have to.

ABOUT Ultrasonic Machining

WHAT IS ULTRASONIC MACHINING?

Ultrasonic machining is a loose abrasive machining process in which the mirror image of a shaped tool can be created in hard, brittle materials.

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Materials We Machine

We Machine Hard, Brittle & Specialty Materials including:

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Features and Patterns Possible

Bullen can machine a limitless number of different cuts and shapes, including:

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  • Round Holes
  • Rectangular Holes
  • Odd-shaped holes
  • Slots
  • Blind Cuts
  • Cavities
  • OD and ID Work

Features ranging in size from 0.008″ up to several inches are possible in small workpieces, wafers, larger substrates, and material blanks.

Aspect ratios as high as 60-to-1 are possible, depending on the material type and feature size.

Applications

Ultrasonic machining broadens the possibilities for your projects

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  • Tight-tolerance round thru-holes for semiconductor processing equipment components
  • Micromachined and micro-structured glass wafers for microelectromechanical systems (MEMS) applications
  • Features machined into Ceramic Matrix Composites for Aerospace manufacturing

Advantages of Ultrasonic Machining

Bullen’s Ultrasonic Machining process had many advantages over traditional machining.

The process is non-thermal, non-chemical, and non-electrical, leaving the chemical and physical properties of the workpiece unchanged. This low-stress process translates into high reliability for your critical applications.

Multiple features can be machined at the wafer or substrate level simultaneously, and the process is often the highest quality and lowest cost solution. If there is a better option available for your project, we’ll let you know.

High-aspect ratio thru-vias; 60-to-1 aspect ratios are possible in glass and advanced ceramic.

Unlike many competing laser and abrasive blasting processes, ultrasonic machining is able to provide vertical sidewalls, so you don’t have to compromise on your design.

The process integrates well with semiconductor ceramics and MEMS Machined features, and it can be aligned to previously patterned, machined, or etched substrates.

PARTNERING WITH

GLOBAL ADVANCED TECHNOLOGY COMPANIES

FOR OVER 50 YEARS

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Fortune 50 Companies

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Aerospace & Defense Companies

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Mems & Microsystem Developers

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Medical & Life Sciences Organizations

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Semiconductor Equipment Manufacturers

A Simple Process to Solve Your Complex Engineering Need 

1

Talk to Our Team

2

plan

3

Prototype & pilot

4

produce

News

U.S. Acting Secretary of Labor Julie A. Su recognized Bullen Ultrasonics as one of the 838 recipients of the 2024 HIRE Vets Medallion Award during a virtual award ceremony presented by the U.S. Department of Labor on October 31st, 2024. Bullen earned the Platinum award for being an employer of veterans after reapplying earlier this […]

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