Bullen glass wafers exhibit:
Surface finish Ra< 15A and TTV < 9 microns
Minimal to no sub-surface damage means premium performance for anodic bonding applications and post-polish etching processes
Superior flatness and parallelism
|Pyrex®, Schott Borofloat®, Hoya SD-2, Fused Silica and Quartz||2.0″to 8.0″, 50.8 mm to 200 mm, and thicknesses >0.350 mm||Ground edge with safety bevel||Ultrasonic cleaning in coin-style packaging is standard (slotted wafer containers available upon request)||Clean room packaging, semi-standard notches and flats available|
For expedited delivery, we maintain an inventory of standard wafer sizes 4″(100 mm), 6″(150 mm), and 8″(200 mm) in thicknesses of 0.5 mm, 0.7 mm, and 1.0 mm. Non-standard glass substrates, including square and rectangular, can be custom fabricated.