Semiconductor Ceramics
Semiconductor equipment manufacturers, fabricators, and ceramic material manufacturers rely on Bullen for precision machining & Drilling of critical ceramic components for semiconductor process equipment.
ISO 9001 Certified
AS9100 Certified
IATF 16949 Compliant
ITAR Registered
You’ve Perfected the Design – Don’t Compromise it
Bullen’s extensive knowledge in the machining of glass and ceramics, combined with unique ultrasonic machining capabilities, enables us to provide custom, high-quality, cost-effective solutions that meet the strict requirements of the semiconductor industry.
Conventional Machining
(Laser, EDM)
Higher Part Costs
Lower Process Yield
Common Processing Defects
Subsurface Damage
Longer Process
Bullen Ultrasonic Machining
Reduced Part Costs
Higher Process Yield
Greater Design Reliability & Quality
Little To No Subsurface Damage
Reduced Downtime
We Believe You Deserve a Better Solution for your semiconductor component
Preserve Material Reliability
The substrate material’s chemical and physical properties remain unchanged – Non-thermal method results in no HAZ (Heat Affected Zone) and little to no substrate damage.
Expand Design Possibilities
Implement feature sizes not possible with laser machining on thicker substrates. Micron-level accuracy widens the range of capabilities.
Optimize Production
Eliminate inefficiencies that slow down production and increase the cost. Trust in a faster and more cost-effective process.
BULLEN Semiconductor Capabilities
✓ Ultrasonically high aspect ratio precision features in 300 mm diameter components
✓ Materials include CVD Silicon Carbide, Alumina, Sapphire, Aluminum Nitride, Silicon, Silicon Nitride, Yttria, and many others.
Part types typically machined include:
Gas distribution plates, showerheads (electrodes)
Wafer chucks
Wafer Carriers
Machining limitations shouldn’t hold you back
Bullen offers unique capabilities beyond traditional machining
Our proprietary capabilities deliver viable solutions to complex engineering problems.
ULTRASONIC MACHINING
The world’s leading Ultrasonic Machining company, Bullen provides a superior solution to traditional machining when your design requires a feature or pattern in certain hard, brittle, & specialty materials.
Explore Ultrasonic Machining >
MICROLUCENT® MACHINING
Bullen uses unique laser technology to cut precise features in transparent materials. This proprietary technology lowers costs while improving the quality of cuts.
Explore Microlucent® Machining >
News
U.S. Acting Secretary of Labor Julie A. Su recognized Bullen Ultrasonics as one of the 838 recipients of the 2024 HIRE Vets Medallion Award during a virtual award ceremony presented by the U.S. Department of Labor on October 31st, 2024. Bullen earned the Platinum award for being an employer of veterans after reapplying earlier this […]
